Visteon Corporation has announced the automotive industry’s first use of lead-free
solder paste in a printed wiring board (PWB) electronic module. The company received
approval from Ford to manufacture and supply its Passive Anti-Theft System (PATS)
transceiver module using the lead-free solder.
The module uses a lead-free solder paste to replace the tin-lead (Sn-Pb) alloy
solder. Visteon has been researching and developing this technology for several
years and it has exceeded performance requirements in both laboratory analysis
and in-vehicle testing.
Visteon says that the implementation of this technology is a significant step
forward in the manufacturing and supply of lead-free electronics modules due
to the anticipated restrictions on the use of all but trace amounts of lead
in vehicle components in North America, Europe, and Japan.