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Infineon, Qualcomm sign agreement for integrated CPUs

The subsystem combines Infineon’s Aurix microcontrollers and Optireg power-management chips with Qualcomm’s Snapdragon Ride and Ride Flex systems-on-chip.

Shubhendu Vimal November 03 2026

Germany-based Infineon Technologies and Qualcomm have agreed to develop a microcontroller-based subsystem for Qualcomm’s Snapdragon Ride automotive compute platforms.

The reference design is intended for central processing units (CPUs) in software-defined vehicles.

It brings automated driving, driver-assistance functions, and digital cockpit systems into one architecture.

The subsystem combines Infineon’s Aurix microcontrollers and Optireg power-management chips with Qualcomm’s Snapdragon Ride and Ride Flex systems-on-chip (SoC).

It is designed to operate as a functional safety controller, managing real-time functions, monitoring system diagnostics, and carrying out failsafe procedures for safety-critical driving activities.

Infineon will also provide software to connect its microcontroller firmware with Qualcomm’s platform-level safety functions.

The interface standardises connections to vehicle networks, including controller area network and Ethernet links.

The agreement also includes Infineon’s Semper NOR flash memory, which is certified for the Snapdragon platform, and Brightlane USB and Ethernet physical layer components for high-bandwidth data traffic.

Infineon automotive division president Peter Schiefer said: “Our collaboration reflects a fundamental approach to centralised vehicle computing, which combines a powerful SoC with a set of specialised components around it, including a safety microcontroller, power management, connectivity and memory devices.

"All these components need to work together seamlessly to help enable safe vehicle operation. Infineon provides essential functional building blocks and integration expertise for building the trust foundation for software-defined vehicles that leverage the power of AI [artificial intelligence].”  

Infineon plans to showcase the hardware at the Electronica trade exhibition in Munich, Germany, from 10 to 13 November.

In July, Infineon completed the €570m ($653.09m) acquisition of ams Osram Group’s non-optical analogue/mixed-signal sensor portfolio on a debt-free, cash-free basis.

The following month, it entered a partnership with MediaTek to develop an AI-driven in-cabin solution for future vehicles.

MediaTek qualified Infineon’s 512Mb quad SPI (QSPI) NOR Flash, an automotive-grade NOR Flash memory product, for use in its Dimensity Auto Cockpit platform C-X1.

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