The companies are expanding their partnership with a joint power lab to develop scalable power architecture for Stellantis’ software-defined vehicles. Credit: Jonathan Weiss/Shutterstock.

Automaker Stellantis and German chipmaker Infineon have announced a cooperation to develop power architecture for the automaker’s next-generation vehicles.

This collaboration aims to strengthen their partnership through significant supply and capacity agreements that will advance technologies essential for Stellantis’ future vehicle lineup.

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A key aspect of this collaboration is Infineon’s PROFET smart power switches, which will replace traditional fuses, reduce wiring, and allow Stellantis to lead the way in intelligent power network management.

Additionally, silicon carbide (SiC) semiconductors will support efforts to standardise power modules, enhancing the efficiency and performance of electric vehicles (EVs) while reducing costs.

AURIX microcontrollers will also play a critical role in the first generation of the STLA Brain zonal architecture.

The two companies are further extending their partnership with the creation of a joint power lab, which will focus on designing scalable, intelligent power architecture to support Stellantis’ transition to software-defined vehicles.

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Infineon automotive division president Peter Schiefer said: “Infineon is now entering a collaboration and innovation partnership with Stellantis. As the world’s leading automotive semiconductor vendor, we bring our product-to-system expertise and dependable electronics to the table.

“Our semiconductors drive the decarbonisation and digitalisation of mobility. They increase the efficiency of cars and enable software-defined architectures that will significantly improve the user experience.”

In October 2024, Stellantis announced a $29.5m investment in Moving Ground Plane (MGP) technology at its research and technical centre in Auburn Hills, Michigan.

This investment aims to enhance EV aerodynamics through the MGP system, which uses air-cushioned belts to simulate wheel movement, with a central belt replicating road conditions beneath the vehicle.

The advanced aero-acoustic wind tunnel will allow vehicles to remain stationary during testing, providing more accurate aerodynamic data.

This upgrade will enable precise measurements and help reduce airflow resistance from wheels and tyres, which is crucial for improving real-world aerodynamic drag.

Also, this month, Infineon Technologies introduced the MOTIX TLE9189 gate driver IC, designed for safety-critical applications using 12V brushless DC motors.

This new three-phase gate driver IC has been developed to meet the growing demand for motor control ICs required in by-wire solutions.