Automaker Stellantis and Taiwan-based Hon Hai Technology Group (Foxconn) have announced their semiconductors joint venture (JV) SiliconAuto.

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To be headquartered in the Netherlands, it will design and make semiconductors supplying Stellantis and other automotive industry customers starting in 2026.

Stellantis Chief Technology Officer Ned Curic said: “Stellantis will benefit from a robust supply of essential components, which is critical to fuelling the rapid, software-defined transformation of our products.

“Our goal is to build vehicles that seamlessly connect with our customers’ daily lives and deliver class-leading capabilities years after they leave the assembly line. With this joint venture, we can create purpose-built innovations with an efficient partnership.”

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Foxconn Chief Product Officer Jerry Hsiao said: “We look forward to a future of extraordinary EV mobility underpinned by the vertical integration capabilities and resources SiliconAuto secures for our partners.”

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SiliconAuto is the product of a December 2021 agreement between Stellantis and Foxconn. Chips from SiliconAuto will support the future semiconductor needs of Stellantis, Foxconn and other customers. This includes Stellantis’ ‘STLA Brain’ – its new electrical and software architecture.