Infineon Technologies has introduced a 1,300V silicon carbide power (SiC) module in its HybridPACK Drive family for continuous operation at junction temperatures of up to 205°C
The company said the module goes beyond the 175°C limit it described as typical of existing designs.
According to Infineon, the product delivers up to 15% more output current than existing designs, increasing inverter power density.
It said the module retains the same size, footprint and interfaces as current products, enabling drop-in integration into existing inverter platforms without redesign.
Infineon stated that the backwards-compatible design is intended to reduce time-to-market for next-generation inverter programmes while using established manufacturing and qualification processes.
The company said the higher thermal tolerance gives automotive OEMs and Tier 1 suppliers room to reduce or simplify cooling arrangements, which can lower system cost, cut vehicle weight, and improve energy efficiency.
Infineon said the module is also the first in the HybridPACK Drive family to feature a 1,300 V blocking voltage, extending inverter robustness for applications with battery voltages above 900V.
It added that it plans to introduce the 205°C operating capability across its wider 1,200V SiC module portfolio in the same product family.
Infineon automotive high voltage senior vice president and general manager Stefan Obersriebnig said: “We are committed to advancing the performance and efficiency of electric vehicle drivetrains through cutting-edge innovation in high-voltage power products.
“Higher operating temperatures provide our customers with more design flexibility and enable them to lower system cost. This innovation will help them to build even more competitive platforms that accelerate the adoption of electric vehicles.”
The announcement comes after a development in March when Infineon expanded its collaboration with Nvidia to develop system architectures for physical AI, including humanoid robots and digital twin deployment.
That expanded arrangement followed an initial agreement made in August 2025, bringing together Infineon’s motor control, microcontroller, power systems, and security capabilities with Nvidia’s AI, robotics, and simulation platforms, with the stated aim of supporting both the design and large-scale deployment of humanoid robots.
