“Together with our customers, we want to ensure electro-mobility becomes part of people’s everyday life,” said Infineon Automotive Division president, Peter Schiefer.
“Together with Volkswagen, we can identify requirements early on and create innovations that increase the range of electric vehicles or reduce charging times, for example.”
For his part head of Procurement Connectivity, eMobility and Driver Assistance at Volkswagen Group, Michael Baecker, added: “Cooperation with strong partners is a key factor for the success of our electric offensive.
“Our e-models feature technologies and ideas from the most innovative companies in our industry.”
The Volkswagen Group has announced it intends to launch almost 70 new e-models and build 22m e-vehicles during the next ten years. Most of them will be based on the MEB (Modular Electric Drive Toolkit) including the new ID family from the Volkswagen brand, as well as models from Audi, Seat and Škoda.
In 2018, 15 of the 20 top-selling electric models and plug-in hybrid vehicles worldwide used Infineon’s components. The chip manufacturer has a wide range of semiconductors for electro-mobility: from the bare die, discrete components, chips embedded in printed circuit boards, to power modules; the portfolio includes products based on silicon as well as on silicon carbide.
In order to cater for growing demand for power electronics in the automotive industry as well as other sectors, Infineon is expanding its production capacities at its existing plants in Dresden (Germany) and Kulim (Malaysia).
The company is also investing EUR1.6bn (US$1.8bn) in a new factory to produce power semiconductors in Villach (Austria). The new factory is scheduled to go into operation in 2021.