American Axle & Manufacturing. has been granted a patent for an array of heat-sinked power semiconductors. This innovation features a power semiconductor with multiple terminals and a heat sink designed with a base and fins, enhancing thermal management and efficiency in semiconductor applications. GlobalData’s report on American Axle & Manufacturing gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on American Axle & Manufacturing, was a key innovation area identified from patents. American Axle & Manufacturing's grant share as of June 2024 was 63%. Grant share is based on the ratio of number of grants to total number of patents.
Heat-sinked power semiconductor array with unique fin design
The patent US12046529B2 describes an innovative array of heat-sinked power semiconductors designed to enhance thermal management in electronic applications. Each power semiconductor in the array features a semiconductor die with multiple terminals, including a surface mount terminal that connects to a heat sink. The heat sink is characterized by a body with a base and boundary surfaces, from which sets of fins extend. These fins are symmetrically arranged about a plane of symmetry, optimizing airflow and cooling efficiency. The design allows for the integration of the heat sink and fins, with some configurations enabling the fins to be unitarily formed with the heat sink body.
Additionally, the patent outlines various configurations for arranging multiple heat-sinked power semiconductors. These configurations include nested arrangements and the formation of flow channels for coolant, enhancing the cooling capabilities of the system. The heat sink bodies can feature non-parallel fin mount portions, and the arrangement of the semiconductors can be designed around a central longitudinal axis, allowing for efficient spacing and cooling. The claims also specify that the fins of adjacent power semiconductors can face each other, further improving thermal management. Overall, this patent presents a comprehensive approach to optimizing the performance and cooling of power semiconductor arrays in electronic devices.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
