Automaker Stellantis and Taiwan-based Hon Hai Technology Group (Foxconn) have announced their semiconductors joint venture (JV) SiliconAuto.

To be headquartered in the Netherlands, it will design and make semiconductors supplying Stellantis and other automotive industry customers starting in 2026.

Stellantis Chief Technology Officer Ned Curic said: “Stellantis will benefit from a robust supply of essential components, which is critical to fuelling the rapid, software-defined transformation of our products.

“Our goal is to build vehicles that seamlessly connect with our customers’ daily lives and deliver class-leading capabilities years after they leave the assembly line. With this joint venture, we can create purpose-built innovations with an efficient partnership.”

Foxconn Chief Product Officer Jerry Hsiao said: “We look forward to a future of extraordinary EV mobility underpinned by the vertical integration capabilities and resources SiliconAuto secures for our partners.”

SiliconAuto is the product of a December 2021 agreement between Stellantis and Foxconn. Chips from SiliconAuto will support the future semiconductor needs of Stellantis, Foxconn and other customers. This includes Stellantis’ 'STLA Brain' - its new electrical and software architecture.