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LG teams up with Qualcomm on AI-driven in-car cockpit system

The South Korean electronics giant will present its AI Cabin Platform at CES 2026 in Las Vegas between 6 and 9 January.

Rachana Saha December 12 2025

LG Electronics (LG) has joined forces with Qualcomm Technologies for its next-generation AI Cabin Platform, an in-vehicle infotainment (IVI) system.

The South Korean electronics giant will present its AI Cabin Platform at CES 2026 in Las Vegas between 6 and 9 January.

LG said its system leverages generative artificial intelligence (AI), including vision-language models, large language models and image generation, running on Qualcomm’s Snapdragon Cockpit Elite.

The platform fetches information from both internal and external vehicle cameras to assess the driving situation and the driver’s condition.

As an example, LG said the system can provide an alert if it detects a nearby vehicle starting to merge and determines the driver has not noticed.

LG added that the platform can generate customised IVI user interfaces that change according to outside conditions.

According to LG, all AI processing is performed on the vehicle device rather than in the cloud.

It aims to remove the need for cloud connectivity for real-time operation, while supporting privacy and data security.

Earlier this year, at CES 2025, LG and Qualcomm presented a high-performance computing platform designed to combine IVI and advanced driver assistance systems (ADAS) within a single control unit, based on Qualcomm’s Snapdragon Ride Flex system-on-chip.

LG Vehicle Solution Company president Eun Seok-hyun said: “Based on our proven technology and global trust, we will continue expanding partnerships with innovators like Qualcomm Technologies to drive future mobility beyond the SDV to the AIDV.

“With the AI Cabin Platform, we are creating mobility that not only understands drivers, but responds proactively to their needs and preferences, making every journey uniquely personal.”

Last year, LG Electronics offered a preview of its latest vehicle in-cabin sensing technologies developed in partnership with US AI semiconductor design firm Ambarella, ahead of the full market launch.

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