The companies also opened a joint innovation centre today.
HMC selected Infineon as a semiconductor partner for this long term strategic cooperation in order to develop automotive electronic system solutions for its Hyundai and KIA vehicles. The cooperation includes the development of automotive electronics system architecture and related semiconductors, along with enhancements of current automotive electronic systems.
The new Hyundai Infineon Innovation Centre (HIIC) will work on the functional and cost optimisation of car electronics systems, as well as develop automotive electronic system architecture, including the design of ECU and application-specific integrated circuits (ASICs) in powertrain, safety and body applications.
The centre is located at the Yangjae-dong headquarters of the Hyundai-Kia Automotive Group in Seoul and will be co-managed by both companies. At the beginning, development activities will focus on automotive electronics system architecture and related automotive electronics products in body applications, such as light modules, HVAC (heating, ventilating and air conditioning) and door modules. The companies expect the first jointly developed products to be used in cars from 2010.
Based on semiconductor technology, the companies will cooperatively analyse existing applications regarding cost optimisation and system quality improvement by integration of functions and reduction of components using application specific standard products (ASSPs) or ASICs.
Financial details of the tie-up were not disclosed.