Tesla had three patents in metaverse during Q1 2024. The patent filed by Tesla Inc in Q1 2024 describes a voltage regulating module design with a first layer outputting regulated voltage based on stepped down voltage, and a second layer stacked with active components providing the stepped down voltage. The layers have overlapping recesses, with the first layer having a larger footprint. Multiple VRMs can be arranged to form an opening with a counterbore for a faster, with the first layer having a larger clearance from the fastener than the second layer. GlobalData’s report on Tesla gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Tesla grant share with metaverse as a theme is 33% in Q1 2024. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Voltage regulating module design for the use of underfill (Patent ID: US20240061482A1)
The patent filed by Tesla Inc. describes a voltage regulating module (VRM) design that includes multiple layers with overlapping recesses, where the first layer outputs a regulated voltage based on a stepped-down voltage and the second layer contains active components to provide the stepped-down voltage. The VRM also features a plurality of contacts, such as a ball grid array, for outputting the regulated voltage. Additionally, the VRMs can be arranged in an array with openings for fasteners, where the first layer has a larger clearance from the fastener compared to the second layer, ensuring efficient operation and assembly.
Furthermore, the patent details a multi-chip module configuration with integrated circuit (IC) dies stacked with VRMs, each VRM having a first layer for outputting regulated voltage and a second layer with active components. The VRMs are connected to the IC dies through a ball grid array encapsulated with an underfill. The design also includes fasteners in openings between VRMs, with the first layer having a larger clearance to prevent clogging by the underfill. The system is equipped with a cooling system to actively cool the VRMs, ensuring optimal performance for the multi-chip module, which includes a system on wafer (SoW) and a thermal dissipation structure for efficient heat management.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
