Hanon Systems has filed a patent for an integrated cooling module that eliminates hoses or pipes, reducing weight and size. The central manifold houses components, refrigerant flow channels, and communication holes, creating a cooling circulation circuit. GlobalData’s report on Hanon Systems gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Hanon Systems, EV integrated thermal mgmt was a key innovation area identified from patents. Hanon Systems's grant share as of January 2024 was 57%. Grant share is based on the ratio of number of grants to total number of patents.
Integrated cooling module for miniaturization and weight reduction of cooling system
The patent application (Publication Number: US20240034126A1) describes an integrated cooling module that includes a central manifold with a mounting space for components, refrigerant flow channels, and communication holes. The components are mounted on the central manifold and communicate with the refrigerant flow channels, creating a cooling circulation circuit. The refrigerant flow channels may have different pressures and heights, with upper and lower channels formed within the central manifold. The module also includes an accumulator assembling structure, condenser, expansion valve, and chiller mounted on the central manifold to facilitate the flow of refrigerant through various channels.
Furthermore, the integrated cooling module features PT sensors connected to the refrigerant flow channels on the central manifold's surfaces, mounting bosses in the communication holes, and a long plate-shaped central manifold with a predetermined thickness. The cooling circulation circuit within the module allows for the introduction and discharge of high-temperature, high-pressure refrigerant, leading to the production of low-temperature, low-pressure gaseous refrigerant that is eventually discharged outside. The design of the central manifold and the arrangement of components ensure efficient cooling performance and temperature control within the system. Overall, the integrated cooling module described in the patent application offers a comprehensive solution for managing refrigerant flow and temperature regulation in various cooling applications.
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