Toyota, Nissan, Honda, Mazda and Subaru have joined forces with a number of Japanese electronic component manufacturers to conduct research and development into high-performance digital semiconductors (system on chip, SoC) for use in automobiles.
The twelve companies, including electronic component manufacturers such as Denso Corporation, Panasonic Automotive Systems, Cadence Design Systems, Mirise Technologies Corporation, Renesas Electronics Corporation, Socionext Inc and Synopsys, last month established the Advanced SoC Research for Automotive (ASRA) partnership to develop next generation automotive SoC designs using chiplet technology.
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The automakers jointly confirmed that around 1,000 semiconductors are currently used in a typical passenger vehicle, with the types varying significantly depending on their application. Among these, SoCs are essential semiconductors for autonomous driving technology and multimedia systems and require state-of-the-art semiconductor technology to achieve advanced computing power according to ASRA.
With the automakers playing a central role, ASRA aims to enhance the levels of safety and reliability of future automotive SoCs. The partnership brings together the “technological and experiential knowledge” of electrical and electronic component and semiconductor manufacturers, with the aim to apply cutting-edge technologies to next generation vehicles including combining different semiconductor types in the SoC design.
ASRA, chaired by Keiji Yamamoto – senior fellow at Toyota Motor Corporation, aims to establish in-vehicle chiplet technology by 2028 and to install these SoCs in mass-produced vehicles from 2030. The partnership will look to promote domestic and international collaboration and establish itself as a world-leading technology research group by working with industry, government and academia.
