Germany-based chipmaker Infineon and Visteon, an automotive cockpit electronics supplier, have signed a memorandum of understanding (MOU) to enhance the development of next-generation electric vehicle (EV) powertrains.

This partnership aims to integrate Infineon's advanced semiconductor technologies into Visteon's power conversion modules, focusing on wideband gap device technologies.

The joint effort will leverage Infineon's wideband gap semiconductors, such as CoolGaN (Gallium Nitride) and CoolSiC (Silicon Carbide), known for their superior power density, efficiency, and thermal performance.

Infineon said, these attributes are crucial for developing high-efficiency, cost-effective power conversion modules for the automotive industry.

Visteon electrification product line head Tao Wang said: “Working with Infineon allows us to integrate cutting-edge semiconductor technologies that are essential in improving power conversion efficiency and overall system capability of next generation electric vehicles.

"This collaboration will advance technologies that accelerate the transition to a more sustainable and efficient mobility ecosystem.”

Visteon's future EV powertrain applications, including battery junction boxes, DC-DC converters, and on-board chargers, will incorporate these advanced devices from Infineon.

The partnership is expected to yield powertrain systems that meet the highest standards of efficiency, robustness, and reliability.

Infineon Technologies Automotive chief sales officer Peter Schaefer added: “Visteon is a recognized innovator and an early adopter of new technologies, making them an ideal partner for us. Together, we will push the boundaries of electric vehicle technology and provide superior solutions to the global automotive industry.”

In April, Infineon has also signed a significant acquisition deal with Marvell Technology’s Automotive Ethernet business.

The company has agreed to purchase Marvell's Automotive Ethernet business for $2.5bn in cash.