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Daily Newsletter

06 February 2024

Daily Newsletter

06 February 2024

Infineon and Honda sign MoU on chips

Strategic collaboration is for automotive semiconductor solutions but they will also discuss ‘supply stability’

David Leggett February 05 2024

Strategic collaboration for automotive semiconductor solutions and they will also discuss ‘supply stability’

Infineon Technologies and Honda have signed a Memorandum of Understanding (MoU) to build a strategic collaboration in the area of semiconductors.

Honda said it has selected Infineon as semiconductor partner to align future product and technology roadmaps.

The two companies also agreed to continue discussions on supply stability, as well as to encourage transferring mutual knowledge and collaborate on projects aimed at accelerating the time to market of technologies.

“Infineon’s system understanding, our broad product portfolio and outstanding quality have made us an appreciated partner to Japan’s automotive industry,” said Peter Schiefer, President of the Automotive Division at Infineon.

“We are honoured to be the semiconductor partner for a strategic collaboration with Honda. Intensifying a long-standing partnership even further is always a confirmation of the added value created and at the same time an expression of the trust in contributing to future successes.”

Infineon will support Honda with technologies to enable competitive and advanced vehicles. The technical support will focus on the area of power semiconductors, Advanced Driver Assistance Systems (ADAS), and E/E architectures, where both parties will collaborate on new architecture concepts.

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