Semiconductor manufacturer Infineon Technologies and United Microelectronics Corporation have extended their manufacturing partnership into power semiconductors for automotive applications.
The foundry has been producing Infineon’s logic chips for over 15 years. Based on the recently signed agreement, both companies will jointly transfer Infineon’s automotive-qualified Smart Power Technology (SPT9) to UMC and extend its production to 300mm wafers. Production starts at UMC in Taiwan early in 2018.
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SPT9 is a proprietary 130-nanometer (nm) process technology of Infineon that combines microcontroller intelligence and power technology on a single die.
“We are proud to announce this milestone in our partnership with Infineon to bring SPT9 into UMC’s technology roadmap,” said Po-Wen Yen, CEO of UMC. “Automotive applications are a key priority for our technology, capacity and customers, and we are pleased to extend our collaboration with Infineon into power semiconductors for automotive applications. With our strong manufacturing excellence, UMC is capable of meeting the highest-rated Grade 0 automotive industry quality standards.”
