Renesas Electronics has announced a new organisational structure and management team appointments effective 1 January, 2024, to “support the company in its next phase of growth and development to become the leader in embedded semiconductor[s]”, according to a statement.
The chip maker said it was establishing a technology based organisation to provide “more comprehensive and tailored solution offerings”. This is aimed at effectively addressing the converging needs of customers and markets by leveraging the company’s embedded processing, analogue, power and connectivity expertise to create complete products.
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The new organisation will also enable the company to capitalise on scale advantages by fostering more cross selling opportunities and broader customer coverage. As part of these changes, the businesses will be restructured into four new product groups.
Analogue & Connectivity
Davin Lee, currently vice president (VP) of the advanced analogue division, will become senior vice president (SVP) and general manager (GM) of analogue & connectivity. The group will be responsible for analogue products as well as the company’s large range of connectivity products.
Embedded Processing
Toshihiko Seki, currently VP of MCUdevice solution division, becomes SVP and GM of embedded processing. He will be responsible for the ’ entire standard catalogue of embedded processing products. The group will boost the company’s efforts to provide more catalogue products to new and existing customers.
High Performance Computing
Vivek Bhan, currently SVP and co-GM of high performance computing, analogue and power solutions group, becomes GM of high performance computing responsible for the custom and application-specific high computing products.
Power
Chris Allexandre, currently SVP, chief sales & marketing officer (CSMO) and head of the global sales and marketing unit, will be SVP and GM of power responsible for overseeing power management and discrete products plus power strategies.
Renesas is also streamlining its organisational structure by establishing new groups of functions to serve as “centralised foundations across all lines of business to better support customers, enhance performance and add value”.
As the company aims to change the way customers design systems through a cloud based platform, Buvna Ayyagari has recently joined as VP of the new software & digitalisation organisation.
She has previously worked for Applied Materials, Synopsys and Intel in engineering, field applications engineering, marketing, customer support and managed products from concept to high volume production.
Operations
Sailesh Chittipeddi, currently EVP, GM of embedded processing, digital power and signal chain solutions group, will now oversee a new operations organisation which brings manufacturing, supply chain and procurement into a single operation.
Engineering
Renesas is establishing a centralised organisation covering product to test engineering and direct development and execution of technology and product strategy. Takeshi Kataoka, SVP and co-GM of high performance computing, analogue and power solutions group, will newly head this engineering organisation.
Quality assurance
Kataoka will also be SVP and head of engineering and quality assurance.
Sales & marketing
Bobby Matinpour, currently VP of global strategic vertical and regional Sales, will replace Chris Allexandre as SVP, CSMO and head of sales and marketing.
All new appointees will report directly to the CEO.
