South Korea’s Hyundai Mobis and US chip-maker Qualcomm Technologies announced at the Consumer Electronics Show (CES 2026) in Las Vegas that they have signed a comprehensive agreement to co-develop next-generation solutions for Software-Defined Vehicles (SDVs) and Advanced Driver Assistance Systems (ADAS).
Hyundai Mobis also confirmed that the two companies plan to jointly develop integrated solutions tailored for emerging markets, while pursuing broader global supply opportunities by “leveraging Hyundai Mobis’ expertise in system integration, sensor fusion, and perception with Qualcomm Technologies’ leadership in system-on-chip (SoC) technology.”
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The two companies will begin their collaboration with the co-development of advanced driving and parking solutions based on the Snapdragon Ride Flex system-on-ship (SoC). These innovations will target fast-growing markets such as India, where Hyundai Mobis suggested ADAS adoption “is expanding across vehicle segments alongside rising demand for SDV-ready architectures.”
For future SDV applications, the two companies plan to collaborate on the development of next-generation integrated solutions that combine Hyundai Mobis’s standardized software platform with Qualcomm Technologies’ Snapdragon automotive technologies to enhance performance, efficiency, and stability.
The signing of the memorandum of understanding (MoU) in Las Vegas was attended by Jung Soo-Kyung, head of Hyundai Mobis’ Automotive Electronics Business Unit, and Nakul Duggal, the head of Qualcomm’s Automotive, Industrial and Embedded IoT, and Robotics division.
