Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting structure includes socket frames and screws for enhanced performance. GlobalData’s report on Tesla gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Tesla, Battery management systems was a key innovation area identified from patents. Tesla's grant share as of April 2024 was 51%. Grant share is based on the ratio of number of grants to total number of patents.
Multi-chip module with ic dies, sockets, cold plate
A recently granted patent (Publication Number: US11973004B2) discloses a multi-chip module design that includes a Redistribution Layer (RDL) substrate with Integrated Circuit (IC) dies mounted on both surfaces. The module also features sockets, a cold plate, and a unique mounting structure with socket frames and screws. The RDL substrate is manufactured using a semiconductor process, and the design allows for flexibility in the number of sockets serviced by each socket frame.
Additionally, the multi-chip module can accommodate Voltage Regulator Modules (VRMs) and second IC dies with embedded capacitor arrays. The patent also outlines a method for mounting the module to a substrate, involving steps such as encapsulating IC dies, attaching floating frames or molded sockets, mounting a thermal interface module, and installing a cold plate. The method includes securing the sockets with screws and adding voltage regulator modules onto the substrate, providing a comprehensive approach to assembling and mounting the multi-chip module efficiently.
To know more about GlobalData’s detailed insights on Tesla, buy the report here.
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