Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting structure includes socket frames and screws for enhanced performance. GlobalData’s report on Tesla gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Tesla, Battery management systems was a key innovation area identified from patents. Tesla's grant share as of April 2024 was 51%. Grant share is based on the ratio of number of grants to total number of patents.
Multi-chip module with ic dies, sockets, cold plate
A recently granted patent (Publication Number: US11973004B2) discloses a multi-chip module design that includes a Redistribution Layer (RDL) substrate with Integrated Circuit (IC) dies mounted on both surfaces. The module also features sockets, a cold plate, and a unique mounting structure with socket frames and screws. The RDL substrate is manufactured using a semiconductor process, and the design allows for flexibility in the number of sockets serviced by each socket frame.
Additionally, the multi-chip module can accommodate Voltage Regulator Modules (VRMs) and second IC dies with embedded capacitor arrays. The patent also outlines a method for mounting the module to a substrate, involving steps such as encapsulating IC dies, attaching floating frames or molded sockets, mounting a thermal interface module, and installing a cold plate. The method includes securing the sockets with screws and adding voltage regulator modules onto the substrate, providing a comprehensive approach to assembling and mounting the multi-chip module efficiently.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
