BYD has been granted a patent for an electronic device housing featuring a frame and a multi-layered sealing layer. This sealing layer consists of sub-sealing layers with varying compositions and thermal expansion coefficients, enhancing the device’s structural integrity and performance. GlobalData’s report on BYD gives a 360-degree view of the company including its patenting strategy. Buy the report here.
Smarter leaders trust GlobalData
Discover B2B Marketing That Performs
Combine business intelligence and editorial excellence to reach engaged professionals across 36 leading media platforms.
According to GlobalData’s company profile on BYD, Battery management systems was a key innovation area identified from patents. BYD's grant share as of July 2024 was 67%. Grant share is based on the ratio of number of grants to total number of patents.
Electronic device housing with layered sealing for thermal expansion
The granted patent US12075583B2 outlines an innovative electronic device housing that incorporates a multi-layer sealing structure designed to enhance thermal stability and bonding between components. The housing consists of a frame, a sealing layer made up of several sub-sealing layers, and a back case. Notably, the thermal expansion coefficients of these sub-sealing layers are engineered to vary from the frame to the back case, which is crucial for accommodating thermal stresses. Each sub-sealing layer is composed of a specific weight ratio of glass powder to binder (88-92:8-12), with adjacent layers featuring different glass powder compositions. This design aims to optimize the thermal performance and durability of the electronic device.
Additionally, the patent details various configurations for the frame and back case materials, including options for metal, ceramic, and glass. A bonding promotion layer may be included to enhance adhesion between the frame and sealing layer, with specific structural and material characteristics outlined to ensure compatibility. The sealing layer's thermal expansion coefficient is strategically positioned between those of the frame and back case, maintaining a difference of no more than 10% to minimize stress during temperature fluctuations. The patent also specifies that the glass powder used in the sealing layers can be free of lead and may consist of various types of glass powders, ensuring environmental safety and material performance. Overall, this patent presents a comprehensive approach to improving the structural integrity and thermal management of electronic device housings.
To know more about GlobalData’s detailed insights on BYD, buy the report here.
Data Insights
From
The gold standard of business intelligence.
Blending expert knowledge with cutting-edge technology, GlobalData’s unrivalled proprietary data will enable you to decode what’s happening in your market. You can make better informed decisions and gain a future-proof advantage over your competitors.
GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
