Delphi Automotive has marketed a new electrical center technology that helps OE manufacturers improve electrical center packaging and reduce assembly costs by using micro-fuses for circuit protection. The new electrical center is on display at the SAE World Congress this week.
“As electronics in the vehicle continue to increase, suppliers such as Delphi are challenged with packaging more content into smaller spaces,” said Mark Potesta, global product line director, Delphi Electrical Centers. “Delphi’s first-to-market solution utilizing micro-fuses in electrical centers helps reduce packaging size by as much as 30 percent. When the amount of space needed for an electrical center is decreased, prime real estate becomes available for added content consumers may want in their next vehicle.”
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This size reduction is achieved using smaller micro-fuses and high-current printed circuit board (PCB) mounted relays. According to Potesta, by using micro-fuses, which are 35 percent smaller than traditional mini-fuses, more circuits can be placed in a given area on the PCB, allowing the electrical center to accommodate more content and functionality.
To further increase PCB layout options, M-case style fuses with smaller terminals and a 15 percent tighter centerline are utilized to improve circuit densities in higher current, slow-blow circuits. For load control optimization, high-current PCB mounted relays offer lower coil current for reduced power dissipation and deliver the same high current performance of the larger plug-in style relays they replace.
Delphi electrical centers with improved circuit protection are currently in production and available for use in a variety of customer applications.
