MediaTek has teamed up with Japanese automotive components manufacturer Denso to jointly develop a custom automotive system-on-chip (SoC).
The SoC is aimed at advanced driver-assistance systems (ADAS) and cockpit applications.
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MediaTek, a Taiwanese semiconductor company, said the jointly developed SoC will combine Denso’s expertise in vehicle integration and functional safety with its semiconductor technologies developed through its Dimensity AX platform.
The partners intend the joint solution to serve as a scalable, production-ready foundation for future driver-assistance platforms.
According to the companies, development is focused on three core areas: automotive-grade safety, artificial intelligence (AI) compute and perception capabilities, and reducing time to market.
MediaTek is contributing heterogeneous computing resources to the platform, including dedicated AI and neural processing unit accelerators, as well as advanced image signal processing to support ADAS workloads.
The architecture is designed to support multi-sensor fusion across cameras, radar and lidar, with vision processing pipelines developed together with Denso’s automotive domain expertise.
The companies said the joint platform is expected to shorten development cycles and improve design quality by using pre-validated automotive-grade intellectual property, safety work products, reference designs and toolchains.
Technical elements of the SoC platform include full functional safety support through features such as a safety island and lockstep processing, automotive networking technologies including TSN, CAN FD and LIN, and multi-camera MIPI CSI-2 interfaces.
MediaTek Automotive Business corporate vice president and general manager Mike Chang said: “Through this collaboration, we are bringing two industry leaders together to support the most demanding requirements of global automotive manufacturers and system integrators, exceeding benchmarks in safety, power efficiency, and AI-enabled perception to advance the future of assisted driving.”
