Toyoda Gosei has filed a patent for a foamable resin composition. The composition includes a styrenic thermoplastic elastomer and a dynamically crosslinked thermoplastic elastomer, with specific amounts specified. It also includes high-temperature expandable microcapsules and low-temperature expandable microcapsules in specific amounts relative to the elastomers. The patent claim outlines the specific details of the composition. GlobalData’s report on Toyoda Gosei gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Toyoda Gosei, Passive safety systems was a key innovation area identified from patents. Toyoda Gosei's grant share as of September 2023 was 32%. Grant share is based on the ratio of number of grants to total number of patents.
Foamable resin composition with expandable microcapsules and elastomers
A recently filed patent (Publication Number: US20230312900A1) describes a foamable resin composition and a method for producing a molded resin foam using this composition. The composition consists of a styrenic thermoplastic elastomer and a dynamically crosslinked thermoplastic elastomer, with the dynamically crosslinked elastomer comprising 10 to 40 parts by mass of the total composition. Additionally, the composition includes high-temperature expandable microcapsules and low-temperature expandable microcapsules, with the microcapsules making up 25 to 50 parts by mass of the elastomers. The low-temperature microcapsules account for 17 to 67% by mass of the total microcapsule amount.
The method for producing a molded resin foam involves molding the foamable resin composition at a temperature where the high-temperature expandable microcapsules do not burst, but the low-temperature expandable microcapsules burst at least partially. This process allows for the controlled expansion of the microcapsules and the formation of a foam structure.
The resulting molded resin foam comprises the styrenic thermoplastic elastomer, the dynamically crosslinked thermoplastic elastomer, high-temperature expandable microcapsules, and low-temperature expandable microcapsules. The high-temperature microcapsules expand without bursting, while the low-temperature microcapsules expand and burst partially. The foam has specific characteristics, including a specific gravity of 0.3 or less, an Asker C hardness of 45 or less, and a compression set (JIS K 6400-4, method A, compressibility: 50%) of 35% or less.
This patent presents a foamable resin composition and a method for producing a molded resin foam with specific properties. The combination of the styrenic thermoplastic elastomer and the dynamically crosslinked thermoplastic elastomer, along with the high-temperature and low-temperature expandable microcapsules, allows for controlled expansion and foam formation. The resulting foam has a low specific gravity, indicating a lightweight material, and a low hardness and compression set, suggesting good flexibility and resilience. This foam could have potential applications in various industries, such as packaging, insulation, and cushioning, where lightweight and flexible materials are desirable.
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