Sheldahl, Inc. announced today that it received production purchase orders from a major DSP and ASIC Semiconductor company for significant volume of the Company's Micro Products' ViaThin(TM) tape ball grid array (TBGA) substrates over the next twelve months. The initial order requires more than 300,000 parts per month and near term forecasts of more than 500,000 parts per month. These substrates will be used in packaging high-performance application specific integrated circuit (ASIC) silicon technology. The package embodiment will be TBGA assembled by Sheldahl on heat spreaders, initially for ASIC designs in the 352 to 600 lead-count range.