Sheldahl, Inc. announced today that it received production purchase orders from a major DSP and ASIC Semiconductor company for significant volume of the Company's Micro Products' ViaThin(TM) tape ball grid array (TBGA) substrates over the next twelve months. The initial order requires more than 300,000 parts per month and near term forecasts of more than 500,000 parts per month. These substrates will be used in packaging high-performance application specific integrated circuit (ASIC) silicon technology. The package embodiment will be TBGA assembled by Sheldahl on heat spreaders, initially for ASIC designs in the 352 to 600 lead-count range.

The latest silicon technology provides customers with the ability to support increased levels of functionality with extremely small, cost-effective die sizes. Sheldahl's two-metal layer ViaThin TBGA package configuration supports die sizes up to 50 percent smaller than competing enhanced BGA (EBGA) packages, allowing very tight staggered wire-bonding pitch to accommodate ever-shrinking die geometries. Additionally, the package supports high-frequency electrical requirements and high thermal dissipation levels. This enables Semiconductor Companies to provide their customers with a high-performance solution at a very competitive overall component cost.

Jim Havener, Sheldahl Micro Products' Vice President remarked, "The major investment in a state-of-the-art, high volume factory for two metal layer tape substrates, coupled with our state-of-the-art technology, makes it possible for Sheldahl to supply this backlog of more than $5 million over the next few months. We are excited to have the opportunity to meet this ASIC Supplier's need for a major production scale-up to over 500,000 parts per month. This also demonstrates the value of ViaThin TBGA's for packaging high performance ASIC and DSP Semiconductors. Our in-place capacity allows us to meet this demand without disturbing our commitments to meet other customer's requirements."

Sheldahl is a leading producer of high-density substrates, high-quality flexible printed circuitry, and flexible laminates primarily for sale to the automotive, electronics and data communications markets. The Company, which is headquartered in Northfield, Minn., has operations in Northfield; Longmont, Colo.; South Dakota; Toronto, Ontario, Canada; and Chihuahua, Chih., Mexico. Its sales offices are located in Detroit, Mich.; Hong Kong, China; Singapore; and Mainz, Germany. As of June 1, 2000, Sheldahl employed approximately 820 people. Sheldahl's common stock trades on the Nasdaq National Market tier of the Nasdaq Stock Market under the symbol: SHEL. In its fiscal year ended August 27, 1999, Sheldahl reported revenues of $122.1 million. Sheldahl news and information can be found on the World Wide Web at www.sheldahl.com

The discussion above contains statements within the meaning of the Private Securities Litigation Reform Act of 1995. These statements by their nature involve substantial risks and uncertainties as described by Sheldahl's periodic filings. Actual results may differ materially depending on a variety of factors, including but not limited to the following: the achievement of Sheldahl's projected operating results, the ability of Sheldahl to successfully obtain waivers from its lenders for any defaults on its debt covenants, the achievement of efficient volume production and related sales revenue results at Longmont, the ability of Sheldahl to identify and successfully pursue other business opportunities, and Sheldahl not entering into an agreement with respect to a transaction or any such transaction not being consummated. Additional information with respect to the risks and uncertainties faced by Sheldahl may be found in, and the prior discussion is qualified in its entirety by, the Risk Factors contained in the Company's filings with the Securities and Exchange Commission, including Sheldahl's Annual Report, Form 10-K for the fiscal year ended August 27, 1999, Forms 10-Q for the quarters ended November 26, 1999; February 25, 2000, and other SEC filings. Sheldahl does not undertake any obligation to update any such factors or to publicly announce developments or events relating to the matters described herein.